Industry-Standard Type B Configuration: Features the precise physical mounting bracket layout, footprint, and wiring terminal configuration designated for Type B hardware bays, ensuring a seamless drop-in replacement.
Premium Solvent & Chemical Resilience: Constructed with high-grade, corrosion-resistant internal diaphragms that strictly resist swelling, dissolving, or turning brittle when exposed to strong solvent flushes, UV monomers, or thick DTF white pigments.
Low Noise & Vibration-Dampened Layout: Features a perfectly balanced motor configuration to completely eliminate structural micro-vibrations, protecting sensitive printhead carriage mechanics and securing sharp graphic outputs.
Industry-Standard Type B Configuration: Features the precise physical mounting bracket layout, footprint, and wiring terminal configuration designated for Type B hardware bays, ensuring a seamless drop-in replacement.
Premium Solvent & Chemical Resilience: Constructed with high-grade, corrosion-resistant internal diaphragms that strictly resist swelling, dissolving, or turning brittle when exposed to strong solvent flushes, UV monomers, or thick DTF white pigments.
Low Noise & Vibration-Dampened Layout: Features a perfectly balanced motor configuration to completely eliminate structural micro-vibrations, protecting sensitive printhead carriage mechanics and securing sharp graphic outputs.
| Parameter | Specification |
| Part Name | Industrial Inkjet Micro Diaphragm Fluid Pump (Type B) |
| Chassis Designation | Type B Standard Footprint |
| Pump Type | Dual-Function Positive/Negative Pressure Micro Pump |
Maintain flawless fluid dynamics and stabilize your printer's line velocity with our premium Type B Micro Diaphragm Pump. Precision-engineered as an essential liquid and air management component for wide-format industrial printing systems, this commercial-grade Type B hardware module provides the steady, low-pulsation flow required for continuous sub-tank replenishment, active ink recirculation, or capping station vacuum priming.
